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Impurity Incorporation...
 
論文名稱:Impurity Incorporation in the Cu Electrodeposit and Its Effects on the Microstructural Evolution of the Sn/Cu Solder Joints 發表人:Hsuan Lee, Tai-Yi Yu, Hsi-Kuei Cheng, Kuo-Chio Liu, P...
Effects of Cu Electrop...
 
論文名稱:Effects of Cu Electroplating Formulas on the Interfacial Microstructuresof Sn/Cu Joints 發表人:Tai-Yi Yu, Hsuan Lee, Hsuan-Ling Hsu, Wei-PingDow, Hsi-Kuei Cheng, Kuo-Chio Liu, and Chih...
Effects of Brighteners...
 
論文名稱:Effects of Brighteners in a Copper Plating Bath on Throwing Power and Thermal Reliability of Plated Through Holes 發表人:Tzu-Chi Chen, Yao-Lin Tsai, Chia-Fu Hsu, Wei-Ping Dow*, and Yas...
In situ STM Imaging of...
 
論文名稱:In situ STM Imaging of Polyethylene Glycol Adsorbed on an Au(111) Electrode in pH3 發表人:Lai-Han Li, Shuehlin Yau*, and Wei-Ping Dow* 發表時間:2016年 發表期刊名:Electrochemist...
Electrodeposition of C...
 
論文名稱:Electrodeposition of Copper on an Au(111) Electrode Modified with Mercaptoacetic Acid in Sulfuric Acid 發表人:Chao-Shan Lai, Xiao-Xuan Hu, Shuehlin Yau*, Wei-Ping Dow* 發表時間:201...
Trap and Release of Bi...
 
論文名稱:Trap and Release of Bisphenol-A, 2-Naphthol, and Doxepin Using a 1-Hexadecylamine-copper(II)-amine Functionalized Indium-tin-oxide Electrode 發表人:Guo-Rong Lin, John Biechele-Speziale...
Optimization of the Co...
 
論文名稱:Optimization of the Copper Plating Process Using the Taguchi Experimental Design Method I. Microvia Filling by Copper Plating Using Dual Levelers 發表人:Chia-Fu Hsu, Wei-Ping Dow*, Hou...
Microvia Filling with ...
 
論文名稱:Microvia Filling with Nickel-Tungsten Alloy to Decrease the Coefficient of Thermal Expansion of Electronic Circuit Interconnections 發表人:Yu-Tien Lin, Hsin-Man Huang, Hsin-Wei Wang, W...

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